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Multi chip modules are the cutting edge of "boards" design.
Their pins density, routing complexity, and layers constructions are
several times more complex then regular printed circuit boards. In
addition, a special knowledge is required in the specifics of the three
types of MCM technologies: MCM-C (Ceramics), MCM-D (Deposited thin films)
and MCM-L (Layered). An extensive knowledge and experience has been
developed at Largo, especially in the field of Cofired Ceramics MCM.
Numerous modules have been designed in Alumina and Aluminum Nitride
substrates, Using Thin film and Thick film technologies. The work is done
in close cooperation with the foundry to assure optimal utilization of the
manufacturing capabilities and to maximize yield.
The sample below is
of a 4" x 2.6" Aluminum Nitride module, for military
application, with a 21 layer construction. It incorporates extensive high
speed design rules on a 5 mil line and 4 mil vias technology.
![Multi Chip Module [81 KB]](mcm.gif)
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