Placement and Routing Instructions

Placement Instructions

* Components that must be placed at a specific location.
* Components that must be placed in a specific orientation.
* Components that must be placed near other components.
* Components that must have extra clearance around them.
* Height consideration that might affect the placement.
* Thermal consideration that might affect the placement.
* Specify if the board will be wave soldered, and in what direction.

Routing Instructions

* Number of signal layers.
* Number of planes.
* Impedance requirements.
* High current lines.
* Clock lines (high rise time lines).
* Lines that need to be daisy chained.
* Lines that need to be shielded.
* Crosstalk consideration.
* Matched length lines.
* Noise sensitive lines.
* Lines that must be routed in specific layers.
* Lines that must/must_not run in a specific area.
* Lines with length constraints.

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